Franhais Computer Heat Sink, Radiator Thermal Conductivity Thermal Cooling Fin Copper Accessory
Franhais Computer Heat Sink, Radiator Thermal Conductivity Thermal Cooling Fin Copper Accessory
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Franhais Computer Heat Sink, Radiator Thermal Conductivity Thermal Cooling Fin Copper Accessory

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Key item features

  • Material- The radiator is made of high-quality copper + graphene, which has good thermal conductivity, rust and corrosion resistance, and is durable.
  • High performance- It is designed to maximize the surface area in contact with the cooling air. It can reduce the risk of hardware failure due to overheating.
  • Practicality- The product is light in weight and has good thermal conductivity. Easy to install, installation only takes a few seconds.
  • Convenience- The pad has good adhesion and conductivity, and can be easily attached to the IC chip set and heat sink.
  • Widely used- This is a large radiator that can be used as a countermeasure for rectangular electronic devices. It can be used for heat dissipation of PC CPU, IC chip, power adapter and various small electronic devices.
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