3D and Circuit Integration of MEMS, (Hardcover)

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3D and Circuit Integration of MEMS, (Hardcover)
Author: Wiley-Vch
ISBN: 9783527346479
Format: Hardcover
Publication Date: 2021-04-13
Page Count: 528

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Book format
Hardcover
Fiction/nonfiction
Non-Fiction
Genre
Computing & Internet
Pages
528
Subgenre
Materials Science
Series title
No Series

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Dieses Referenzwerk ist eine umfassende und systematische Einführung in die Technologien für das Packaging und die heterogene Integration von Mikrosystemen. Der Schwerpunkt liegt auf MEMS aus Silikon, die in großem Umfang zum Einsatz kommen, und auf Technologien zur Systemintegration. Die Themenbereiche umfassen u. a. Bulk-Mikromechanik, Oberflächen-Mikromechanik, CMOS-MEMS, Wafer-Verbindungen, Waferbonden und Wafer-Sealing.

3D and Circuit Integration of MEMS, (Hardcover)
Author: Wiley-Vch
ISBN: 9783527346479
Format: Hardcover
Publication Date: 2021-04-13
Page Count: 528

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Specifications

Book format

Hardcover

Fiction/nonfiction

Non-Fiction

Genre

Computing & Internet

Pages

528

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