

Eotvia Domga MCN-UV50 Soldering Paste Flux, Yellow
Key item features
- Excellent Performance: Soldering flux with excellent performance for reliable soldering.
- Noncorrosive: Noncorrosive to integrated circuit boards, ensuring safe use.
- Effective Application: Boiling point slightly higher than that of soldering tin for effective application.
- Compact Design: Lightweight and compact design for easy handling and convenience.
- Fast Cleaning: Facilitates fast cleaning and insulation during the soldering process.
- High Bonding Strength: Butter-like ointment with high bonding strength, neutral, strong insulation, and welding.
- Versatile Use: Ideal for flux soldering in electronic products, PCB, BGA, etc.
- Specifications: Mode: UV50, Color: Yellow, Viscosity: 0.2PaS, Granularity: 0.22um, Weight: Approx. 35g.
Specs
- Brazing & welding flux typeNeutral
- FormCream
- BrandEotvia
- Rec. useCleaning
- MaterialButter-like ointment
- Size35g
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About this item
Product details
Description:
The paste flux is a butter-like ointment with high bonding strength, neutral , strong insulation and welding . It is suitable for flux soldering in electronic product, PCB, BGA, etc.
Features:
1. soldering flux with excellent performance.
2. Use without concerns - not corrosive to integrated circuit board.
3. Its boiling point is slightly higher than that of soldering tin.
4. Lightweight with small volume, easy and convenient to use.
5. Easy and soldering with this flux, as well as fast cleaning and insulation.
6. Ideal for flux soldering in electronic product, PCB, BGA, etc.
Specifications:
Mode;: UV50
Color: Yellow
Viscosity: 0.2PaS
Granularity: 0.22um
Weight: Approx. 35g
Instructions:
1. Wipe the of the object before soldering.
2. Apply the paste flux to the solder joint.
3. Solder the tin to the solder joint with soldering iron.
Package List:
1 x Paste Flux
Eotvia Domga MCN-UV50 Soldering Paste Flux, Yellow
- Soldering flux with excellent performance for reliable soldering
- Noncorrosive to integrated circuit boards, ensuring safe use
- Boiling point slightly higher than that of soldering tin for effective application
- Lightweight and compact design for easy handling and convenience
- Facilitates fast cleaning and insulation during the soldering process
Specifications
Brazing & welding flux type
Form
Brand
Rec. use
Warranty
Warranty information
Warnings
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