Teissuly Maintenance Solder Paste Leaded Medium Temperature

Teissuly Maintenance Solder Paste Leaded Medium Temperature
Maintenance Solder Paste Leaded Medium Temperature
Features:
Supported by new technology, the unique chemical provides excellent wettability and ensures high reliability. High-precision SMT/BGA welding process suitable for mobile phone maintenance industry, computer digital service industry and printed circuit board welding.
High-end quality, unique , perfect performance, easy to weld, bright and full solder joints, no solder joints, no solder joints. The is colorless and transparent, does not affect detection, and has unique cleaning performance. Using high-efficiency thixotropic agent, pressure and preheating collapse, special solder ensures good pressure and fine patterns.
Moisturizing, anti-drying, long shelf life at room temperature. Unique solder paste, exquisite soft packaging (35g/piece), filigree appearance.
Solder paste is a new type of soldering material that comes with SMT. Solder paste is a system consisting of paste, solder powder, and other additives. At normal temperature, the solder paste has a certain viscosity, and the electronic components can be initially adhered to the predetermined position. At the soldering temperature, the soldered component and the board are soldered together and the and some additives evaporate (permanent connection).
Use with adequate ventilation. Solder paste contains . skin contact. If solder paste gets on your skin, wipe it off with rubbing and rinse thoroughly with water. Avoid contact with eyes. Stay away from children.
Product Description:
Specification
Weight: 35 grams
Package includes: 1 * Sn63Pb37 (leaded average temperature) 35g + 1 * print + 2 * needles