Mobile Phone Heat Sink Cooling Area Increase Board Magnetic Phone Cooler Cooling Surface Amplifier Parts

Feature:
The super glue does not fall off, the super glue is firmly adsorbed, and there is no need to worry about the radiator falling off. Thin and light experience, the thickness is only 1mm, which is very suitable for mobile phones. There is silicone protection, does not hurt the phone, easy to carry and paste, there is silicone protection, soft and does not hurt the machine.

Description:
Product Name: Composite Uniform Heating Plate;
Product size: 60 x 106 x 28mm;
Material: metal;
Product category: common model (used with semiconductor heat dissipation back clip, back material conductive silicon paper), magnetic (general magnetic model and back clip model radiator use, back material double-sided adhesive);
How to use: Connect to the back of the mobile phone, use a radiator to increase the heat dissipation area, and realize the heat dissipation of the mobile phone CPU and camera. The magnetic absorption product is embedded in the magnetic plate and pasted seamlessly, and the magnetic absorption radiator can be directly adsorbed and used.
Packing list:
1 x Mobile Phone Heat Sink
1 x Bagged
Note:
1. Due to manual measurement, please allow 1-3cm error. Make sure you don't mind before bidding.
2. Due to the difference of different monitors, the picture may not reflect the actual color of the product. Thanks.