SIEYIO Pure Copper Heatsink Cooler Heat Sink Thermal Conductive Adhesive for M.2 NGFF 2280 PCI-E NVME SSD Thickness 1.5/2/3/4mm
SIEYIO Pure Copper Heatsink Cooler Heat Sink Thermal Conductive Adhesive for M.2 NGFF 2280 PCI-E NVME SSD Thickness 1.5/2/3/4mm
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SIEYIO Pure Copper Heatsink Cooler Heat Sink Thermal Conductive Adhesive for M.2 NGFF 2280 PCI-E NVME SSD Thickness 1.5/2/3/4mm

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Key item features

    • The ultra thin radiator is designed for the notebook and some small space heat dissipation.
    • Pure copper has higher thermal conductivity than pure aluminum.
    • Heat exchanger can exude heat faster by heat exchange through contact with air.
    • Support for the for M.2 NGFF SSD.
    • Support for the NGFF SSD type 22x80.
  • The ultra thin radiator is designed for the notebook and some small space heat dissipation.|Pure copper has higher thermal conductivity than pure aluminum.|Heat exchanger can exude heat faster by heat exchange through contact with air.|Support for the for M.2 NGFF SSD.|Support for the NGFF SSD type 22x80.
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