MOMOJIA BGA Repair Stencil For 15 14 13 12 11 Motherboard Chip Ball Solder Template

Features:
Engineered with hardened steel for increased durability, this soldering stencil resists wear during intensive repair while preventing solder bridging through patterns.
Features block excess solder overflowing, ensuring precise IC chip protective and reduced short circuit risks during soldering operations.
Ideal for professional technicians and enthusiasts handling board repairs, rework, or component fixes across requiring solderma--alignment.
Streamlines complex repair workflows in workshops or home studios with easy installation, maintaining efficiency during phone screen replacements or charging port repairs.
Rigorously tested against actual IC chips, this professional steel stencil delivers consistent high frequency repairs for mobile service centers or electronics restoration projects.

Specifications:
Component:Metal
Type:B/A/C/D/E
Size:Approx.10cm/3.93inch

Note:
1.Please allow 1-2cm errors due to manual measurement, making sure that you not mind before order.
2.Due to the differences between different monitors, the picture may not reflect the actual of the item.

Package includes:
1 Set Reballing Stencil