TekLine TEP256 Lead Solder Paste 63/37 Syringe Dispenser

This is a 35 gram syringe - includes bonus dispensing tips

TekLine TEP256 is a paste solder developed for high volume SMT reflow soldering. It is a no-clean solder paste specifically designed for robustness in reflow profiling. TEP256 has a wide reflow processing window.

Residues that remain after soldering are almost colorless, leaving a cosmetically appealing repair. The residue has high electrical resistance and is safe to be left on the assembly after soldering.


Features:

TekLine TEP256 no Clean Solder Paste
63/37 Tin/Lead, the most common for electronics work
Packed as pictured. 8cc syringe contains 35 grams of solder paste
Kit Includes five 19-gauge dispensing tips
Stable wetting behavior over a wide range of profiles
Excellent soldering to a wide variety of metals
No-clean flux formula. The residues don't need to be removed for typical applications
Flux residue is non-corrosive and non-conductive
Stored in refrigeration until shipment
Factory fresh, NOT SURPLUS. Shipped in labeled package with date code. Shelf life 6mos from DOM

A few warnings and cautions:

For industrial use only
We can not offer advice on a specific application. For use by experienced electronics technicians
User assumes all risk for application.
Any warranties are limited to replacement or refund of product.
Always wear safety glasses when working with soldering equipment and materials
Always use adequate ventilation when working with soldering equipment and materials
Avoid breathing flux fumes emitted during soldering.
Flux fumes may cause pulmonary irritation or damage.
This product may contain chemicals known to the state of California to cause cancer and/or other reproductive harm.