Soldering Flux Paste 559 Thicker BGA Solder Paste High Viscosity - 10ml/10cc

Features : 

• Professional advanced 559 BGA soldering paste flux
• 223 has less to time work with but easier too clean good for IC Re work
• 559 has more working time a little harder to clean
• Good for Difficult IC work
• 100% new brand and high quality
• Good immersion and high intensity joint
• Easy to peel off with hands or tweezers, leave no residue
• Won't oxidating gold, copper, phosphorus, bronze, oxidation
• Prevent contamination during assembly
• RMA-223/559: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips
• RMA-223/559 is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue
• High soaking ，high strength joints
• No-toxic, no-corrosive, strong ability of insulation
• Good insulation and smooth welding surface
• No deterioration no dry
• No poison no orrosion, no damage to parts
• Flux Type: RMA-559
• Volume: 10ml/10cc
• Dimension: 93 x 33 x 23mm
• Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue
• Insulated: Yes
• Application: for soldering and reballing of computer and phone chips
• Advantage:  Good immersion and high intensity joint
• Function:  for PCB , BGA , PGA rework

Package Includes : (1) X Soldering Flux Paste 559 Thicker BGA Solder Paste High Viscosity - 10ml/10cc